The high-end market is pretty much reserved for Qualcomm, as neither Samsung nor Huawei is selling their Exynos and Kirin chipsets to other companies. Qualcomm also wants to dominate the mid-range market and is now working on a new chipset called Snapdragon 670 that is expected to arrive with some major improvements.

The chipset is rumoured to use next-generation Kryo cores, with two power Kryo 360 cores and six low-powered Kryo cores. It will also use the more efficient 10nm LPP, or Low Power Plus process, for even greater efficiency than those SoCs manufactured using the LPE or Low Power Early technology.

It will also use ARM’s DynamIQ tech, next-generation Adreno 6-series GPU and support facial recognition and an in-display fingerprint sensor.