As expected, Samsung has just announced that is has started mass production of Exynos 7 Dual 7270 chipset for wearables. The mass production of the chipset comes only weeks after the company started mass production of Exynos 7 Quad 7570 for smartphones.

The Exynos 7270 is manufactured using 14nm FinFET process technology and uses Samsung’s innovative packaging technology, SiP (system-in-package)-ePoP (embedded package-on-package) that should offer outstanding performance and energy-efficiency within a compact solution optimized for wearable devices. It is also the first in its class to feature full connectivity and LTE modem integration.

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